Thermal conductivity filler, as the name implies, is added in the matrix material used to increase the thermal conductivity of the filler, commonly used thermal conductivity filler are: Alumina, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, etc.;Among them, especially micron Alumina, silicon powder work as the dominant roles.

The product has spherical, near spherical and angular compact crystal structure, good dispersion, good interface compatibility with organic polymer materials, it can meet the requirements of high filling amount;The narrow particle size distribution, high chemical purity, thermal conductivity and good insulation performance. application: the product is mainly used in organic silicon and epoxy polymer materials, the main application products such as thermal insulation silicon sheet (pad), thermal conductivity silicone grease, silicone oil and thermal conductive epoxy potting glue, double-sided tape, thermal plastic, electronic packaging, etc.

1)spherical alumina with high thermal conductivity

1, high sphericity, can meet the requirements of high filling amount;

2. Narrow particle size distribution.

• 2)near spherical alumina with high thermal conductivity

1, like spherical compact crystal structure, particle surface is smooth, high conversion rate, can meet the requirements of high filling amount;

2, narrow particle size distribution,

3, high chemical purity, low eletrical conductivity;

1, granular compact crystal structure, high conversion rate, good interface compatibility with organic polymer materials;

2, narrow particle size distribution,

3, high chemical purity, low eletrical conductivity;

• 4)Spherical alumina prepared by melt injection method

1. Narrow particle size distribution;

2, low eletrical conductivity, high conversion rate;

3, high chemical purity, good insulation performance.

The morphology of Alumina has a great influence on the thermal conductivity of alumina.Spherical alumina ultra-micro powder products are micron powder with high thermal conductivity, high insulation, high hardness, high temperature resistance, wear resistance, corrosion resistance, etc.It has the characteristics of high purity, good morphology, good stability, narrow particle size distribution, and higher thermal conductivity with a small amount of filling.

Thermal conductive spherical alumina products are suitable for: various silica gel system, epoxy system, engineering thermal conductive plastic system, all kinds of thermal sealing glue, all kinds of rubber system, fine polishing system.

Spherical high purity alumina in electronic materials, thermal insulation materials, special ceramics and other fields.It is widely used in the fields of heat-conductive and heat-resistant fillers, electronic ceramics, polishing materials, high-grade abrasives, etc. It can also be used as the raw material of microporous ceramics and ceramic filter membrane, especially for rubber and plastic fillers. It has the characteristics of low viscosity, good fluidity, high filling, low wear and high purity.It has great market potential.